No Clean 63 Leaded Soldering Bundle

Flux on, Flux Off, Flux on, Flux Off. This Concorde Solder curated bundle delivers a complete no clean soldering workflow with three fully compatible products designed for PCB assembly, electronics rework, and through hole soldering. The foundation is Kester 24 6337 8800 Sn63Pb37 eutectic solder wire (0.031 inch diameter, 1.1 percent 245 No Clean flux) with its sharp 183 degree Celsius melting point for reliable hand soldering that leaves minimal residue and requires no post-solder board cleaning in most applications. Paired with the Kester 951 No Clean flux pen for targeted flux application to pads and component leads, and the Chemtronics ES1696 Flux Off No Clean Plus aerosol for optional residue cleanup without leaving behind additional residue, this bundle covers every step from solder application through board finishing. All three items share no clean chemistry, ensuring complete compatibility and workflow consistency across production environments, surface mount work, and any soldering task where minimizing board cleanup is a priority. Whether you're optimizing for speed, reducing solvent exposure, or simply prefer a matched kit that handles solder, flux, and optional cleanup in one coordinated system, this bundle provides the confidence that every component works together as intended. This bundle comes with a roll of Kester 24-6337-8800 Solder, 245 No Clean Flux core, 0.031" Diameter with a melting point of 183 degrees C, 361 degrees F. A Kester No Clean Flux dispensing pen, and Chemtronics No Clean Flux Remover for efficient clean up!

• Bundle Contents: 1x Kester 24-6337-8800 Sn63Pb37 Solder Wire + 1x Kester 951 No Clean Flux Pen + 1x Chemtronics ES1696 Flux Off No Clean Plus
• Kester 24-6337-8800: Sn63Pb37 eutectic alloy, 0.031 inch (0.8mm) diameter, 1.1% 245 No Clean flux, sharp 183°C eutectic melting point, minimal residue, made in the USA
• Kester 951 Flux Pen: No Clean flux pen, targeted application for improved wetting on pads and component leads before or during soldering
• Chemtronics ES1696: Flux Off No Clean Plus, cleans no clean flux residue, oxide particles, grease, and oil without leaving residue, effective on rosin based and synthetic no clean flux
• No Clean Compatibility: All three items use no clean chemistry, fully compatible with each other for a consistent no clean workflow from solder application through optional board cleanup
• Cleanup Note: 245 No Clean flux residue can be left on the board in most applications. ES1696 provides optional cleanup when needed.
• Best For: No clean PCB assembly, electronics rework, through hole soldering, surface mount work, production environments where board cleaning is minimized, complete matched no clean soldering workflows
• Documents: TDS · SDS